SN74CBTLV1G125DBVR Texas Instruments IC LV SINGLE FET BUS SW SOT-23-5

label:
2026/07/6 127
SN74CBTLV1G125DBVR Texas Instruments IC LV SINGLE FET BUS SW SOT-23-5


CATALOG
SN74CBTLV1G125DBVR COUNTRY OF ORIGIN
SN74CBTLV1G125DBVR PARAMETRIC INFO
SN74CBTLV1G125DBVR PACKAGE INFO
SN74CBTLV1G125DBVR MANUFACTURING INFO
SN74CBTLV1G125DBVR PACKAGING INFO
SN74CBTLV1G125DBVR ECAD MODELS


COUNTRY OF ORIGIN
Philippines
China
Malaysia
Thailand


PARAMETRIC INFO
Logic Function Bus Switch
Number of Elements per Chip 1
Number of Inputs per Chip 1
Number of Outputs per Chip 1
Configuration 1 x 1:1
Logic Family CBTLV
Process Technology 0.6um
Maximum On Resistance (Ohm) 15(Typ)
Minimum Operating Supply Voltage (V) 2.3
Maximum Operating Supply Voltage (V) 3.6
Typical Operating Supply Voltage (V) 2.5|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Maximum Propagation Delay Time @ Maximum CL (ns) 0.25@3.3V
Absolute Propagation Delay Time (ns) 5
Propagation Delay Test Condition (pF) 50
Maximum High Level Output Current (mA) -128
Maximum Low Level Output Current (mA) 128
Maximum Quiescent Current (uA) 10
 

PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 5
Lead Shape Gull-wing
PCB 5
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 2.9
Package Width (mm) 1.6
Package Height (mm) 1.1
Package Diameter (mm) N/R
Package Overall Length (mm) 2.9
Package Overall Width (mm) 2.8
Package Overall Height (mm) 1.18
Seated Plane Height (mm) 1.18
Mounting Surface Mount
Terminal Width (mm) 0.4
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec MO-178
Package Outline Link to Datasheet
Maximum PACKAGE_DIMENSION_H (mm) 1.3
Minimum PACKAGE_DIMENSION_H (mm) 0.9
Maximum PACKAGE_DIMENSION_L (mm) 3.05
Minimum PACKAGE_DIMENSION_L (mm) 2.75
Maximum PACKAGE_DIMENSION_W (mm) 1.75
Minimum PACKAGE_DIMENSION_W (mm) 1.45
Maximum Diameter (mm) N/R
Minimum Diameter (mm) N/R
Maximum Seated_Plane_Height (mm) 1.45
Minimum Seated_Plane_Height (mm) 0.9
Ball Array Length (mm) N/R
Ball Array Width (mm) N/R
Stand-off Height (mm) 0.08
Number of Column Balls N/R
Number of Row Balls N/R
Terminal Length (mm) 0.45
Terminal Thickness (mm) 0.15
Bottom Pad Length (mm) N/R
Bottom Pad Width (mm) N/R
Bottom Pad Chamfer N/R
 

MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 4
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn|Au
Under Plating Material N/A|Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/A
 

PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation Q3
Packaging Document Link to Datasheet
 

ECAD MODELS



Produit RFQ