|
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• Low Standby-Current Consumption of 1 μA Max
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| • I2C to Parallel Port Expander |
| • Open-Drain Active-Low Interrupt Output |
• 5-V Tolerant I/O Ports
|
• Compatible With Most Microcontrollers
|
|
| CATALOG |
PCA9555PWR COUNTRY OF ORIGIN
|
PCA9555PWR PARAMETRIC INFO
|
PCA9555PWR PACKAGE INFO
|
PCA9555PWR MANUFACTURING INFO
|
PCA9555PWR PACKAGING INFO
|
PCA9555PWR ECAD MODELS
|
PCA9555PWR APPLICATIONS
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|
COUNTRY OF ORIGIN
|
China
|
| Taiwan (Province of China) |
| Malaysia |
|
PARAMETRIC INFO
|
| Number of I/Os |
16 |
| Interface Type |
I2C|SMBus |
| I2C Bus Interface Mode |
Fast |
| Interface Speed (kHz) |
100|400 |
| Number of Addresses |
8 |
| Output Type |
Open Drain |
| Minimum Operating Supply Voltage (V) |
2.3 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Source Current per Bit (mA) |
-10 |
| Tolerant I/Os (V) |
5 |
| Maximum Sink Current per Bit (mA) |
25 |
| Internal I/O Pull Up Resistor |
Yes |
| Maximum Quiescent Current (uA) |
1 |
| Manual Reset |
No |
| Interrupt Output |
Yes |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
Gull-wing |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
7.8 |
| Package Width (mm) |
4.4 |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
7.8 |
| Package Overall Width (mm) |
6.4 |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.25 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153 |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H (mm) |
1.05 |
| Minimum PACKAGE_DIMENSION_H (mm) |
N/A |
| Maximum PACKAGE_DIMENSION_L (mm) |
7.9 |
| Minimum PACKAGE_DIMENSION_L (mm) |
7.7 |
| Maximum PACKAGE_DIMENSION_W (mm) |
4.5 |
| Minimum PACKAGE_DIMENSION_W (mm) |
4.3 |
| Maximum Diameter (mm) |
N/R |
| Minimum Diameter (mm) |
N/R |
| Maximum Seated_Plane_Height (mm) |
1.2 |
| Minimum Seated_Plane_Height (mm) |
N/A |
| Ball Array Length (mm) |
N/R |
| Ball Array Width (mm) |
N/R |
| Stand-off Height (mm) |
0.1 |
| Number of Column Balls |
N/R |
| Number of Row Balls |
N/R |
| Terminal Length (mm) |
0.63 |
| Terminal Thickness (mm) |
0.15 |
| Bottom Pad Length (mm) |
N/R |
| Bottom Pad Width (mm) |
N/R |
| Bottom Pad Chamfer |
N/R |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
16.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
| APPLICATIONS |
| • Servers |
| • Routers (Telecom Switching Equipment) |
| • Factory Automation |
| • Products With I2C Slave Address Conflicts (For Example, Multiple, Identical Temp Sensors) |
| |
| |
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