MX35LF1GE4AB-Z4I Macronix IC FLASH SERIAL NAND 1G 8WSON

2026/07/8 137

CATALOG

Taiwan (Province of China)

Density (bit)	1G
Cell Type	NAND
Interface Type	Serial
Block Organization	Asymmetrical
Boot Block	No
Timing Type	Synchronous
Architecture	Non Sectored
Maximum Access Time (ns)	8
Programmability	Yes
Typical Operating Supply Voltage (V)	3\|3.3
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Supplier Temperature Grade	Industrial
Number of Bits per Word (bit)	4
Number of Words	256M
Maximum Supply Current (mA)	30
Programming Voltage (V)	2.7 to 3.6
Program Current (mA)	30
Address Width (bit)	24
Minimum Operating Supply Voltage (V)	2.7
Maximum Operating Supply Voltage (V)	3.6
Maximum Erase Time (s)	0.0035/Block
Maximum Programming Time (ms)	0.6/Page
Command Compatible	No
ECC Support	Yes
Erase Suspend/Resume Modes Support	No
Simultaneous Read/Write Support	No
Support of Common Flash Interface	No
Support of Page Mode	Yes
Page Size	2Kbyte
Minimum Endurance (Cycles)	100000
Minimum Storage Temperature (°C)	-65
Maximum Storage Temperature (°C)	150
Density in Bits (bit)	1073741824

Supplier Package	WSON EP
Basic Package Type	Non-Lead-Frame SMT
Pin Count	8
Lead Shape	No Lead
PCB	8
Tab	N/R
Pin Pitch (mm)	1.27
Package Length (mm)	6
Package Width (mm)	8
Package Height (mm)	0.75(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	6
Package Overall Width (mm)	8
Package Overall Height (mm)	0.8(Max)
Seated Plane Height (mm)	0.8(Max)
Mounting	Surface Mount
Terminal Width (mm)	0.4
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Very Very Thin Small Outline No Lead Package, Exposed Pad
Package Family Name	SON
Package Outline	Link to Datasheet

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30 to 40
Number of Reflow Cycle	3
Standard	J-STD-020D
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	N/A
Under Plating Material	N/A
Terminal Base Material	N/A
Number of Wave Cycles	N/R

Packaging Document

Link to Datasheet