 |
|
| • Maximum Clock 10 MHz |
• Low-Power CMOS Technology:
- Maximum Write current: 5 mA at 5.5V,
10 MHz
- Read current: 6 mA at 5.5V, 10 MHz
- Standby current: 1 µA at 5.5V |
| • 32,768 x 8-Bit Organization |
| • 64-Byte Page |
| • Self-Timed Erase and Write Cycles (5 ms
maximum) |
• Block Write Protection:
- Protect none, 1/4, 1/2 or all of array |
• Built-In Write Protection:
- Power-on/off data protection circuitry
- Write enable latch
- Write-protect pin |
| • Sequential Read |
• High Reliability:
- Endurance: 1,000,000 erase/write cycles
- Data retention: > 200 years
- ESD protection: > 4000V |
• Temperature Ranges Supported:
- Industrial (I):-40C to +85C
- Extended (E): -40°C to +125°C |
| • RoHS Compliant |
| • Automotive AEC-Q100 Qualified |
|
| CATALOG |
| 25LC256-E/SN COUNTRY OF ORIGIN |
| 25LC256-E/SN PARAMETRIC INFO |
| 25LC256-E/SN PACKAGE INFO |
| 25LC256-E/SN MANUFACTURING INFO |
| 25LC256-E/SN PACKAGING INFO |
| 25LC256-E/SN ECAD MODELS |
|
| COUNTRY OF ORIGIN |
| China |
| Malaysia |
| Taiwan (Province of China) |
| Thailand |
|
| PARAMETRIC INFO |
| Density (bit) |
256K |
| Interface Type |
Serial-SPI |
| Maximum Operating Frequency (MHz) |
10 |
| Maximum Access Time (ns) |
50 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Extended |
| Programmability |
Yes |
| I/O Mode |
Serial |
| Density in Bits (bit) |
262144 |
| Maximum Operating Current (mA) |
6 |
| Hardware Data Protection |
Yes |
| Organization |
32Kx8 |
| Data Retention (Year) |
200(Min) |
| Minimum Operating Supply Voltage (V) |
2.5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Number of Bits per Word (bit) |
8 |
| Address Bus Width (bit) |
16 |
| Process Technology |
CMOS |
|
| |
| PACKAGE INFO |
| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Package Length (mm) |
4.9 |
| Package Width (mm) |
3.9 |
| Package Height (mm) |
1.25(Min) |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
1|3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
| Packaging |
Tube |
| Quantity Of Packaging |
100 |
|
|
| ECAD MODELS |
 |
|
One-stop supplier of IC products